Call For Paper

ChipEx2026 is the major annual event of the Israeli semiconductor & AI industry.

ChipEx2026 invites any person or company involved with the semiconductor & AI industry

to submit a paper addressing a specific problem or a case study related to the process of semiconductor & HW AI design, development, implementation and manufacturing.

Submissions must be made via e-mail: info@chiportal.co.il by March 1, 2026 no later than 7:00pm Israel time. Authors of accepted papers will be invited to present their topic at the ChipEx2026 conference, scheduled for May 12, 2026 in Tel Aviv, Israel.

Topics of Interest

ChipEx2026 seeks papers addressing one of the following tracks:

·       Silicon Architectures for the Era of Advanced Intelligence

·       Power Management & Signal Integrity

·       Analog Design, RF and Sensors

·       Physical Design and Manufacturability

·       IP for SoC & NoC

·       Verification, Simulation, Testing & Security

·       Manufacturing, Packaging and Post Silicon processes

·       Emerging and creative design technologies

·       Users Track – sharing user experience with industry colleagues

The main theme of ChipEx2026 is Building the Future of Silicon with Limitless Dimensions

To make it easy for potential speaking applications, the ChipEx2026 steering committee has decided to introduce a series of key topics that are especially interesting for our audience.  Papers that will address these topics will be treated with higher priority.

Here are the key topics of ChipEx2026:

·       New solutions for Edge AI

·       Using AI for EDA tools and verification

·       Can quantum computing replace current technology nodes

·       Transitioning to Post-CMOS and Analog Computing

·       Turning drones into autonomous system by using onboard processing

·       Pluggable solutions for data center connectivity

·       Vertical Integration of chip power management (VI-CPM)

·       Generative AI in Edge computing   

·       Designing dedicated AI chips for specific tasks

·       Challenges in designing chips for aerospace applications

·       Simplifying the transformation process from FPGA to ASIC

·       Customer experience: Using AI for Verification or Simulation

·       The Advantages of PIM (Processing-in-Memory) for AI Applications

·       Can GenAI shorten the design cycle?

·       New solutions for on chip power dissipation

·       Scaling 3D Heterogeneous Integration (Chiplets)

·       How can RISC-V become alternative to x86 and Arm in HPC

·       Implementing Silicon Photonics with ASIC design

·       Fin-FET and other innovative manufacturing technologies

·       Emulation and verification on the cloud

·       Product Life Management, Automation and Monitoring

·       Reliability, qualification and RMA (Return Material Authorization) procedures

·       AI implementation in chip manufacturing

·       The impact of Multi Physics characteristics on timing signoff, power integrity and thermal reliability

·       3D & 4D Packaging, Heterogeneous Systems and other trends in advanced IC Packaging

·       On-Chip Security and Cyber-Resilient Chip Technologies

·       Integrated circuit design verification tools including Logic Verification

·       New design & implementations for medical applications

·       Manufacturing challenges in 2nm and below

·       Machine vision and image sensors-based technologies

·       Advanced sensors for IoT & Smart Cities applications

·       SOC design for digital health & wearable applications

·       Processors that will fit the 6G era?

·       New trends in semiconductor manufacturing

·       How to improve yields in chip manufacturing

·       Reducing TTM (Time To Market) for System On Chip 

·       Using FPGA to address the needs of today's applications including 6G, Automotive, HPC, HMB and more

·       The Advantages and challenges in silicon photonics

·       Generative AI in Chip, System, and Product Design

·       Using AI to migrate from one nanotechnology to another

·       The latest in RF and millimeter wave design

·       How to ensure data security when using GenAI

Submission Process

The following is the process for any paper submission.

1. The paper should only address one of the selected topics (see below a detailed list of interesting topics). 

2.      Each paper must include an abstract of approximately 50-100 words clearly stating the impact/result or significant contribution of the submitted topic.

3.      The entire paper should not be longer than two pages (including the abstract)

4.      The author must be ready to present the topic at ChipEx2026. The author or his/her representative will have 20 minutes to present the paper.

5.      Presentations should not be biased or focused towards the author's company or business interests.

6.      Papers which were previously published or simultaneously under review by another conference will be rejected, unless received special authorization by the organizers of ChipEx2026.

7.      Authors of accepted papers must sign a "copyright release form".

Submissions not complying with these terms will be rejected.